A key service that adds considerable value to the contract manufacturing of Printed Circuit Assembly (PCA) is the ability to deliver fully tested products, ready to be integrated into the next phase of the product supply chain. By undertaking most of the required testing during the manufacturing process, improvements are accelerated, quality is enhanced and time-to-market is reduced.
Whether the product is a fully configured network, medical product or sophisticated RF module, the appropriate level of testing depends on the product specification and the individual customer requirements. SEM has invested in the latest testing equipment and training to keep up with industry requirements.
The range of post assembly test (PAT) services offered at SEM includes the following:
Some of the equipment/processes used for test and validation are:
We offer passive and active testing on two flying probe platforms. Flying probe testing with Acculogic Scorpion FLS 850 is capable of testing top and bottom side simultaneously.
Flying probe testing with Teradyne Javelin has been upgraded to Acculogic Sprint with single sided testing.
SEM can coordinate in-circuit testing on any platform. We work with qualified testing partners in order to provide a wide range of in-circuit test platforms at affordable costs.
We provide functional testing assistance at any level from PCA to fully integrated systems. We have qualified engineers, technicians and operators to assist in the testing and debugging of your product with the functional testing, as required.
We can assist with JTAG testing and test emulation as part of functional testing or independent test and debug. We can also perform static or dynamic, ambient or controlled temperature burn-in testing.
SEM has invested in 2D and 3D AOI systems, to enhance our inspection capabilities. By placing AOI at critical checkpoints, consistent quality and yields are produced in ramp up, ramp down or day-to-day processes.
SEM has state of the art machines for both 2D and 5D X Ray that are capable of creating many different analysis reports for SMT, through hole and press fit components, including BGA and other exotic components.