In 2019 SEM Made Numerous Valuable Upgrades to Better Serve Our Customer
Improvements of 2019
February: Opened Overseas Engineering Facility
- Full-Service Design and Engineering Facility
- Read this article to learn more about our Engineering Services https://sem-inc.com/sem-new-product-design-and-manufacturing/
May: Added Two Fuji XPF-L
- Dynamic head exchange
- Borderless line optimization
- Fuji intelligent feeders
- Line efficiency improved by 160%
- 0.144 secs/ component- 25,000 comps/ hour
June: Added Nordson 3D SPI
- Co-planarity of chips, BGAs and other height sensitive devices
- Advanced 2D + 3D inspection
- 1 top-down and 4 side viewing cameras
- Minimum Component Size: 008004 with high magnification sensor option
August: Added Vapor Phase VAC 645
- Integrated flexible vacuum system
- Oxygen free soldering
- No overheating of components
- Vacuum process in the vapor phase for void-free soldering
November: Added Two new Fuji XPF-W
- Fully Vision Controlled Chip Shooter
- PCB size, maximum: 20” x 27”
- Capable of placing 160 different components
- Placing accuracy, QFP parts +/-0.040 mm cpk≥1.00 +/-0.053 mm cpk≥1.33