In 2019 SEM Made Numerous Valuable Upgrades to Better Serve Our Customer

February: Opened Overseas Engineering Facility

•  Full Service Design and Engineering Facility

• Read this article to learn more about our Engineering Services http://sem-inc.com/sem-new-product-design-and-manufacturing/

May: Added Two Fuji XPF-L

·        Dynamic head exchange

·        Borderless line optimization

·        Fuji intelligent feeders

·        Line efficiency improved by 160%

·       0.144 secs/ component- 25,000 comps/ hour

June: Added Nordson 3D SPI

·        Co-planarity of chips, BGAs and other height sensitive devices

·        Advanced 2D + 3D inspection

·        1 top-down and 4 side viewing cameras

·       Minimum Component Size: 008004 with high magnification       sensor option

August: Added Vapor Phase VAC 645

·        Integrated flexible vacuum system

·        Oxygen free soldering

·        No overheating of components

·       Vacuum process in the vapor phase for void free soldering

November: Added Two new Fuji XPF-W

·        Fully Vision Controlled Chip Shooter

·        PCB size, maximum: 20” x 27”

·        Capable of placing 160 different components

·       Placing accuracy, QFP parts +/-0.040 mm cpk≥1.00 +/-0.053  mm cpk≥1.33